Meijer Notebook Informacje Techniczne Pobierz pdf (Strona 85)

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Thermal paste is used on the processor (1) and the heat sink section (2) that services it

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A thermal pad is used on the Northbridge chip (3) and the heat sink section (4) that services it

NOTE: The following illustration shows the replacement thermal material locations on a computer

model equipped with an Intel Pentium processor and a graphics subsystem with discrete memory.

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Thermal paste is used on the processor (1) and the heat sink section (2) that services it

●

A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that

services it

NOTE: The following illustration shows the replacement thermal material locations on a computer

model equipped with an Intel Pentium processor and a graphics subsystem with UMA memory.

Component replacement procedures

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Meijer Notebook Informacje Techniczne Strona 85