Meijer Notebook Informacje Techniczne Pobierz pdf (Strona 78)

Remove the system board (3) by sliding it up and to the right at an angle.

NOTE: A heat sink is attached to the base enclosure to service a component on the bottom of

the system board. The thermal material must be thoroughly cleaned from the surfaces of the system

board (1) and the heat sink (2) attached to the base enclosure each time the system board is

removed. Replacement thermal material is included with all base enclosure and system board

spare part kits.

Reverse this procedure to install the system board.

70 Chapter 4 Removal and replacement procedures

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Meijer Notebook Informacje Techniczne Strona 78