Meijer Notebook Informacje Techniczne Pobierz pdf (Strona 92)

NOTE: The following illustration shows the replacement thermal material locations on a

computer model equipped with an Intel processor and a graphics subsystem with discrete memory.

●

Thermal paste is used on the processor (1) and Northbridge chip and the heat sink section

(2) that services them

●

A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that

services it

NOTE: The following illustration shows the replacement thermal material locations on a

computer model equipped with an Intel processor and a graphics subsystem with UMA memory.

Thermal paste is used on the processor (1) and Northbridge chip and the heat sink section (2)

that services them.

84 Chapter 4 Removal and replacement procedures

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Meijer Notebook Informacje Techniczne Strona 92